Japan, Feb. 24 -- JAPAN AVIATION ELECTRONICS INDUSTRY LTD has got intellectual property rights for 'DEVICE.' Other related details are as follows:
Application Number: JP,2022-008089
Category (FI): H01L23/02@B,H01L23/02@G,H05K1/14@G,H10W76/10@G,H10W76/63,H10W90/00,550
Stage: PROBLEM TO BE SOLVED: To provide a device with a novel structure that can be thinned.SOLUTION: A device 10 includes a first sealing member 20, a second sealing member 30, a first circuit member 40, and a second circuit member 50. The first sealing member 20 includes a first film 22 made of a film as a base, and a conductive part 266 made of a conductor. The device 10 includes a sealed space 18. The sealed space 18 is surrounded by the first sealing member 20 and the s...