Japan, Aug. 6 -- DIC CORP has got intellectual property rights for 'CURABLE RESIN COMPOSITION, CURED PRODUCT, INSULATION MATERIAL, AND RESIST MEMBER.' Other related details are as follows:

Application Number: JP,2022-153550

Category (FI): C08G59/17,G03F7/027,515,G03F7/032,502,C08F290/06

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Sept. 27, 2022

Publication Date: April 8, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....