Japan, March 24 -- ABSOLICS INC has got intellectual property rights for 'CORE SUBSTRATE, SUBSTRATE, AND USE OF SUBSTRATE FOR SEMICONDUCTOR PACKAGING.' Other related details are as follows:

Application Number: JP,2023-125196

Category (FI): H01L23/12@C,H01L23/14@C,H05K1/02@C,H10W42/00,100,H10W70/68,200,H10W70/692

Stage: Grant (IP right document published.)

Filing Date: July 31, 2023

Publication Date: Feb. 26, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....