Japan, April 22 -- ARTIENCE CO LTD has got intellectual property rights for 'CONDUCTIVE COMPOSITION FOR MOLDING FILM, MOLDING FILM AND MANUFACTURING METHOD OF THE SAME, AND MOLDED BODY AND MANUFACTURING METHOD OF THE SAME.' Other related details are as follows:

Application Number: JP,2022-131796

Category (FI): C08K3/04,C08K3/08,B32B27/18@J,C08L101/00

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Aug. 22, 2022

Publication Date: March 6, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....