Japan Intellectual Property Rights: CONDUCTIVE BONDING MATERIAL, MANUFACTURING METHOD OF CONDUCTIVE BONDING MATERIAL AND BONDING MEMBER

Japan, Feb. 18 -- TANAKA KIKINZOKU KOGYO KK has got intellectual property rights for 'CONDUCTIVE BONDING MATERIAL, MANUFACTURING METHOD OF CONDUCTIVE BONDING MATERIAL AND BONDING MEMBER.' Other related details are as follows:

Application Number: JP,2023-092252

Category (FI): B22F1/00@K,B22F1/05,B22F7/08@C,B22F9/00@B,H01L21/52@A,H01L21/52@E,H01L21/60,311@Q,H10W72/00,101@Q,H10W72/30@A,H10W72/30@E

Stage: Grant (IP right granted following substantive examination.)

Filing Date: June 5, 2023

Publication Date: Dec. 17, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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