Japan, Aug. 6 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'CONDUCTIVE ADHESIVE, MANUFACTURING METHOD OF CIRCUIT CONNECTION STRUCTURE, AND CIRCUIT CONNECTION STRUCTURE.' Other related details are as follows:

Application Number: JP,2024-130664

Category (FI): H01R11/01,501@C,H01B1/00@C,H01B1/22@D,C09J9/02,C09J201/00,H01B5/16

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Aug. 7, 2024

Publication Date: Oct. 25, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....