Japan, July 31 -- SAMSUNG SDI CO LTD has got intellectual property rights for 'COMPOSITION FOR REMOVING EDGE BEAD FROM METAL-CONTAINING RESISTS, DEVELOPER COMPOSITION OF METAL-CONTAINING RESISTS, AND METHOD OF FORMING PATTERNS USING THE SAME.' Other related details are as follows:

Application Number: JP,2024-164258

Category (FI): G03F7/004,G03F7/32,G03F7/38,501,G03F7/004,531

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Sept. 20, 2024

Publication Date: April 24, 2025

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....