Japan, Aug. 12 -- CMC MATERIALS LLC has got intellectual property rights for 'COMPOSITION AND METHOD FOR POLISHING BORON-DOPED POLYSILICON.' Other related details are as follows:

Application Number: JP,2025-067822

Category (FI): H10P52/20,H10P52/00@H,H10P52/00@Z,H10P52/40,H01L21/304,622@D,H01L21/304,621,C09K3/14,550@D,C09K3/14,550@Z,B24B37/00@H

Stage: Grant (IP right granted following substantive examination.)

Filing Date: April 17, 2025

Publication Date: July 10, 2025

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....