Japan Intellectual Property Rights: CMP CONDITIONING DISC AND METHOD OF MANUFACTURING THE CMP CONDITIONING DISC

Japan, June 10 -- EHWA DIAMOND INDUSTRIAL CO LTD has got intellectual property rights for 'CMP CONDITIONING DISC AND METHOD OF MANUFACTURING THE CMP CONDITIONING DISC.' Other related details are as follows:

Application Number: JP,2024-135670

Category (FI): B24D3/00,310@C,B24D3/00,310@B,B24D3/00,320@B,B24B53/017@A,B24D3/00,340,B24D3/06@A,H01L21/304,622@M,H10P52/00@Q,B24B53/12@Z

Stage: Grant (IP right document published.)

Filing Date: Aug. 15, 2024

Publication Date: Feb. 28, 2025

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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