Japan, March 24 -- ZHUHAI ACCESS SEMICONDUCTOR CO LTD has got intellectual property rights for 'CHIP BUILT-IN PACKAGING SUBSTRATE BY METAL FRAME AND MANUFACTURE METHOD OF THE SAME.' Other related details are as follows:

Application Number: JP,2024-038588

Category (FI): H01L23/12@F,H01L23/12@J,H01L23/36@C,H10W40/20@C,H10W70/00@F,H10W70/00@J,H10W70/62,500,H10W70/655

Stage: Grant (IP right document published.)

Filing Date: March 13, 2024

Publication Date: Oct. 1, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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