Japan, March 26 -- OSAKA UNIV has got intellectual property rights for 'BONDING STRUCTURE, BONDING MATERIAL, AND MANUFACTURING METHOD FOR BONDING STRUCTURE.' Other related details are as follows:
Application Number: JP,2021-196836
Category (FI): B22F1/05,B22F7/08@C,B22F9/00@B,H01L21/52@B,H10W72/30@B
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Dec. 3, 2021
Publication Date: June 15, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....