Japan, Aug. 26 -- TOSHIBA MATERIALS CO LTD,TOSHIBA CORP has got intellectual property rights for 'BONDED BODY AND CERAMIC COPPER CIRCUIT BOARD.' Other related details are as follows:
Application Number: JP,2025-023768
Category (FI): H05K1/03,610@D,C04B37/02@B
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Feb. 17, 2025
Publication Date: April 30, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
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