Japan, July 1 -- NITTO DENKO CORP has got intellectual property rights for 'ADHESIVE SHEET FOR SEMICONDUCTOR WAFER PROCESSING.' Other related details are as follows:
Application Number: JP,2022-099619
Category (FI): C09J133/04,C09J7/38,C09J4/00,C09J11/06,H01L21/78@M,H01L21/304,622@Z,H10P52/00@Z,H10P58/00@M
Stage: Grant (IP right granted following substantive examination.)
Filing Date: June 21, 2022
Publication Date: Jan. 6, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....