Japan, Sept. 7 -- LINTEC CORP has got intellectual property rights for 'ADHESIVE PASTE, METHOD FOR USING ADHESIVE PASTE AND METHOD FOR PRODUCING LIGHT-EMITTING DEVICE.' Other related details are as follows:
Application Number: JP,2022-104841
Category (FI): C09J11/06,C09J183/04,C08G77/14
Stage: Grant (IP right granted following substantive examination.)
Filing Date: June 29, 2022
Publication Date: Jan. 17, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
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