Japan, Aug. 26 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'ADHESIVE FILM FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION STRUCTURE, AND MANUFACTURING METHOD THEREFOR.' Other related details are as follows:
Application Number: JP,2022-128247
Category (FI): C09J7/35,C09J11/04,H01R11/01,501@A,C09J7/30,H01R11/01,501@C,C09J163/00,C09J11/06,C09J9/02,C09J171/10
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Aug. 10, 2022
Publication Date: Feb. 26, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....