Japan, Aug. 24 -- NITTO DENKO CORP has got intellectual property rights for 'ADHESIVE FILM, DICING DIE-BONDING FILM, AND OPTICAL SEMICONDUCTOR DEVICE.' Other related details are as follows:
Application Number: JP,2022-194364
Category (FI): H01L21/78@M,C09J7/35,C09J201/00,C09J11/04,H01L21/52@E,H10W72/30@E,H10P58/00@M
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Dec. 5, 2022
Publication Date: June 17, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....