Japan, July 31 -- DENKA CO LTD has got intellectual property rights for 'ADHESIVE COMPOSITION, BONDED BODY AND METHOD FOR PRODUCING ADHESIVE COMPOSITION.' Other related details are as follows:
Application Number: JP,2024-001671
Category (FI): C09J11/06,C09J4/02,C09J11/08,C09J109/00
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 10, 2024
Publication Date: March 12, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....