India, May 29 -- The Government of India has issued a release:
Union Minister of Electronics & IT, Ashwini Vaishnaw; along with Chief Minister of Odisha, Mohan Charan Majhi; CEO, Intel, Lip-Bu Tan, and other dignitaries, witnessed the signing of an MoU to bring substrate manufacturing technology to India.
The MoU has been signed between the Government of Odisha, Intel Corporation and 3DGS Inc. USA for a framework to establish an Advanced Packaging Glass Core Substrate Manufacturing Facility in Odisha. The project represents one of the largest high-technology manufacturing investments in the country. The facility is proposed to be located in the Bhubaneswar-Khurda region.
Union Minister for Electronics & IT stressed that signing of the la...