MUMBAI, India, Nov. 6 -- Intellectual Property India has published a patent application (202641017073 A) filed by Presidency University, Bangalore on February 16, 2026, for Wire Wrapping Device.
Inventor includes Dr. Mahaboob Pasha.
The application for the patent was published on November 06, 2026, under issue no. 45/2026.
Abstract: A wire wrapping device, comprises of an elongated body 101 with a handle 102 to be held by a user, a user-interaction module to provide input commands for wrapping of a wire, a wrapping module to wrap insulating tape uniformly around a wire, a cutting module to sever the insulating tape upon completion of the wrapping, a robotic gripper 112 secures the tape's starting end, while an inspection module detects c...