Intellectual Property India Publishes Patent Application for Water-Cooled Grinding And Lapping Machine For Large-Diameter Polycrystalline Diamond Wafers

MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202621109328 A) filed by Hetalben Hirenkumar Savaliya; and Hirenkumar Vallabhbhai Savaliya on September 11, 2026, for Water-Cooled Grinding And Lapping Machine For Large-Diameter Polycrystalline Diamond Wafers.

Inventor includes Hirenkumar Vallabhbhai Savaliya.

The application for the patent was published on October 30, 2026, under issue no. 44/2026.

Abstract: A water-cooled machine (1) and process are disclosed for precision grinding and fine lapping of a polycrystalline diamond wafer (57) having a diameter up to 600 mm. The machine (1) includes a spindle assembly (18) carrying a vitrified diamond wheel (26), a force-controlled Z-axis assembly (32),...