Intellectual Property India Publishes Patent Application for Wall Panel System For Providing Thermal Insulation And Sound Damping

MUMBAI, India, Nov. 6 -- Intellectual Property India has published a patent application (202641131046 A) filed by Jain Deemed-To-Be University on November 02, 2026, for Wall Panel System For Providing Thermal Insulation And Sound Damping.

Inventors include Ramachandra N. U; Dr. Shivakumara D. C; Anagha. S; Divyansh Gupta; Nagamani. R; L. A. Ponmukilan; and Tannistha Banerjee.

The application for the patent was published on November 06, 2026, under issue no. 45/2026.

Abstract: A wall panel system for providing thermal insulation and sound damping, comprises a track 101 mounted over a wall substrate, a panel module 102 removably fitted on the track 101, the panel module 102 includes a breathable front layer 102a for allowing sound waves to...