Intellectual Property India Publishes Patent Application for Very Fine Pitch And Wiring Density Organic Side By Side Chiplet Integration

MUMBAI, India, July 24 -- Intellectual Property India has published a patent application (202418088526 A) filed by Apple Inc. on November 15, 2024, for Very Fine Pitch And Wiring Density Organic Side By Side Chiplet Integration.

Inventors include Dabral, Sanjay; Cao, Zhitao; and Hu, Kunzhong.

The application for the patent was published on July 17, 2026, under issue no. 29/2026.

Abstract: Structures and methods of forming fine die-to-die interconnect routing are described. In an embodiment, a package includes a package-level RDL than spans across a die set and includes a plurality of die-to-die interconnects connecting contact pads between each die. In an embodiment, the plurality of die-to-die interconnects is embedded within one or mor...