MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202511000522 A) filed by Schneider Electric India Private Limited on January 02, 2025, for Variable Thermal Arrangement For Molded Case Circuit Breakers (mccbs).
Inventor includes Behera, Subrat Kumar.
The application for the patent was published on July 31, 2026, under issue no. 31/2026.
Abstract: The present disclosure relates to a circuit breaker (100) that includes a release assembly (110) mounted to a housing (102), with a variable thermal arrangement configured to trip the circuit breaker upon detecting an overload condition. A mechanism assembly (114) operably coupled to the release assembly (110) receives a tripping signal and mechanically a...