MUMBAI, India, Oct. 19 -- Intellectual Property India has published a patent application (202647121327 A) filed by Qualcomm Incorporated on October 09, 2026, for Uplink And Downlink Data Plane Aspects.
Inventors include Kanamarlapudi, Sitaramanjaneyulu; Meylan, Arnaud; and Dokku, Vamsi.
The application for the patent was published on October 16, 2026, under issue no. 42/2026.
Abstract: Aspects of the disclosure are directed to downlink data plane aspects of communication. Specifically, communication via low latency, low loss, and scalable throughput (L4S).
Disclaimer: Curated by HT Syndication....