Intellectual Property India Publishes Patent Application for Two-Stage Dissolving Microneedle Patch With Bioadhesive Hydrogel Reservoir For Peptide Delivery

MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202611089924 A) filed by Chitkara University on July 23, 2026, for Two-Stage Dissolving Microneedle Patch With Bioadhesive Hydrogel Reservoir For Peptide Delivery.

Inventors include Dr. Sonia Dhiman; Dr. Shareen Singh; and Dr. Thakur Gurjeet Singh.

The application for the patent was published on September 18, 2026, under issue no. 38/2026.

Abstract: A dual-phase transdermal patch (100) for delivery of a hydrophilic peptide is disclosed. The patch includes a dissolving microneedle array (200) containing a peptide loading dose and a bioadhesive hydrogel reservoir (400) containing a peptide maintenance dose. The microneedle array (200) penetrates skin...