MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202617071032 A) filed by Techno-Umg Co. , Ltd. on June 08, 2026, for Thermoplastic Resin Composition, Resin Molded Article, And Plated Article.
Inventors include Bekku Hideaki; Kawaguchi Hideichiro; and Yamashita Shinji.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: The thermoplastic resin composition is a melt-kneaded product of a rubber-containing graft copolymer (A) obtained by copolymerizing a monomer mixture containing an aromatic vinyl compound and a vinyl cyanide compound in the presence of a rubbery polymer and a copolymer (B) obtained by copolymerizing a monomer mixture containing an aroma...