MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202617093328 A) filed by Dow Global Technologies LLC; and Rohm And Haas Company on July 31, 2026, for Thermally Conductive Compositions.
Inventors include Ruiu, Andrea; Mosciatti, Thomas; and Agarwal, Praveen.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: Embodiments of the present disclosure are directed towards thermally conductive compositions including a urethane/acrylic telechelic polymer, a thermally conductive filler, and an amine.
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