MUMBAI, India, Nov. 6 -- Intellectual Property India has published a patent application (202511034430 A) filed by Momentive Performance Materials Inc. on April 08, 2025, for Thermal Interface Material Composition For Enhanced Reliability.
Inventors include Dolai, Sukanta; Perala, Suresh Kumar; Ms, Anjitha; Kumar, Kaushlendra; Kothapalli, Kalyanachakravarthi; Kondo, Takuya; Choi, David; and Xia, Xuhui.
The application for the patent was published on November 06, 2026, under issue no. 45/2026.
Abstract: The present disclosure relates to compositions for use as thermal interface materials (TIMs) that have predetermined concentration limitations of certain impurities to eliminate stability problems.
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