MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202647072470 A) filed by Meyer Burger Germany Gmbh on June 11, 2026, for System And Method For Vacuum Deposition.
Inventors include Holm, Niels; Barraud, Loris; and Lachenal, Damien.
The application for the patent was published on June 19, 2026, under issue no. 25/2026.
Abstract: The invention relates to a layer deposition system, in particular for depositing at least one localised layer in a plasma-supported deposition system via a mask which partially shades a substrate, which in particular is a solar wafer, on a substrate carrier. The invention also relates to a method and a system for depositing a localised layer pattern on a wafer-like substrat...