MUMBAI, India, Oct. 19 -- Intellectual Property India has published a patent application (202647120792 A) filed by Rf Singapore Pte. Ltd. on October 08, 2026, for Surface Acoustic Wave (saw) Device With Barrier Layers Between Aluminum-Copper Layers.
Inventors include Dietrich, Marc Konstantin; Jewula, Tomasz; and Honal, Matthias.
The application for the patent was published on October 16, 2026, under issue no. 42/2026.
Abstract: Certain aspects of present disclosure are directed towards a surface acoustic wave (SAW) device. The SAW device may include a piezoelectric layer and an interdigital transducer (IDT) disposed above the piezoelectric layer and comprising an electrode including: a first aluminum (Al)-copper (Cu) layer; a second Al-...