MUMBAI, India, Sept. 14 -- Intellectual Property India has published a patent application (202617067709 A) filed by Pregis LLC on May 29, 2026, for Stations For Forming Heat Seals In Envelopes.
Inventor includes Wetsch, Thomas D..
The application for the patent was published on September 11, 2026, under issue no. 37/2026.
Abstract: Stations for sealing envelopes include a spacer, a positioning surface, and an envelope support surface configured to support the envelopes. A sealing mechanism is provided with sealing members configured to apply heat and pressure to a sealable member on the envelope to form a closure seal. The spacer and the positioning surface are configured to align the sealable member with the sealing members when the env...