Intellectual Property India Publishes Patent Application for Stacked Mram With Super Via Structures

MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202647080982 A) filed by International Business Machines on July 01, 2026, for Stacked Mram With Super Via Structures.

Inventors include Hashemi, Pouya; and Liang, Jim Shih-Chun Number.

The application for the patent was published on July 03, 2026, under issue no. 27/2026.

Abstract: A memory structure is provided that includes a first tier including a plurality of first magnetoresistive random access memory (MRAM) cells, and a second tier including a plurality of second MRAM cells. Each second MRAM cell is located above and horizontally offset from each of the first MRAM cells. Each first MRAM cell is sandwiched between a bottom electrically conducti...