MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202647078354 A) filed by Qualcomm Incorporated on June 25, 2026, for Stacked Die Structure.
Inventors include Sun, Yangyang; Patil, Aniket; and Nikfar, Nader.
The application for the patent was published on July 03, 2026, under issue no. 27/2026.
Abstract: In an aspect, an IC device may include a structure wafer and a first die bonded to the structure wafer by a bonding layer. A first metallization structure is disposed below and electrically coupled to the first die opposite the structure wafer. A fill material is disposed between the structure wafer and the first metallization structure. A second metallization structure is disposed on top of the st...