MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202617095202 A) filed by Agc Inc. on August 06, 2026, for Solid Composition For Producing Hollow Molded Article, Hollow Molded Article, And Electric Wire Coating Material.
Inventors include Sahashi Yusuke; Matsumoto Mariko; Shibasaki Kosuke; Abe Kaori; Otsugu Satoshi; and Taguchi Daisuke.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: Provided is a solid composition for producing a hollow molded article, the composition containing primary particles containing a first polymer and a second polymer, wherein the second polymer is a non-melt-moldable fluorine-containing polymer containing a unit based ...