Intellectual Property India Publishes Patent Application for Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, On-Vehicle Electronic Circuit, Ecu Electronic Circuit, On-Vehicle Electronic Circuit Device, And Ecu Electronic Circuit Device

MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202617095626 A) filed by Senju Metal Industry Co. , Ltd. on August 07, 2026, for Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, On-Vehicle Electronic Circuit, Ecu Electronic Circuit, On-Vehicle Electronic Circuit Device, And Ecu Electronic Circuit Device.

Inventors include Iijima Yuki; and Yokoyama Takahiro.

The application for the patent was published on October 30, 2026, under issue no. 44/2026.

Abstract: Provided are: a solder alloy having a low melting point, a high shear strength, and a suitable fracture mode; a solder paste; a solder ball; a solder preform; a solder joint; an on-vehicle electronic circuit; an ECU electro...