MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647087050 A) filed by Asml Netherlands B. V. on July 16, 2026, for Sensor And Method For Qualification Of A Topography Of A Surface Of A Die For Die Bonding.
Inventors include De Jager, Pieter, Willem, Herman; Schouten, Christine, Henriette; Dolk, Victor, Sebastiaan; Wahbeh, Lotfi; Assendelft, Joep; Bustraan, Krijn, Frederik; Sahin, Buket; Alleleijn, Joep, Hanni, Hub, Maria; Broers, Sander, Christiaan; and Venugopalan, Syam, Parayil.
The application for the patent was published on July 24, 2026, under issue no. 30/2026.
Abstract: A system for die bonding comprising a sensor configured to determine a characteristic of a topography of a surface of ...