Intellectual Property India Publishes Patent Application for Semiconductor Device Comprising Airgap Spacers And Backside Power Delivery

MUMBAI, India, Oct. 26 -- Intellectual Property India has published a patent application (202617091445 A) filed by International Business Machines Corporation on July 28, 2026, for Semiconductor Device Comprising Airgap Spacers And Backside Power Delivery.

Inventors include Xie, Ruilong; Vega, Reinaldo; Frougier, Julien; Gaul, Andrew; and Lanzillo, Nicholas Anthony.

The application for the patent was published on October 23, 2026, under issue no. 43/2026.

Abstract: A semiconductor device includes a gate structure on a stack of channel layers, a source/drain region adjacent to the stack of channel layers, and an inner airgap spacer positioned between channels in the stack of channel layers. The inner airgap spacer separates the gate struc...