Intellectual Property India Publishes Patent Application for Reduced Shrink Polymeric Compositions

MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202617093342 A) filed by Dow Global Technologies LLC on July 31, 2026, for Reduced Shrink Polymeric Compositions.

Inventors include Song, Yixuan; Patel, Rajen M.; Sekharan, Manesh Nadupparambil; Brigandi, Paul J.; and Saba, Stacey A..

The application for the patent was published on October 30, 2026, under issue no. 44/2026.

Abstract: A polymeric composition includes 20 wt% to 70 wt% of a first ethylene-based polymer based on a total weight of the polymeric composition, wherein the first ethylene-based polymer has a density of 0.93 g/cc to 0.970 g/cc as measured according to ASTM D792; 5 wt% to 35 wt% of a second ethylene-based polymer based on a tota...