Intellectual Property India Publishes Patent Application for Profile Constrained Assembly For Mobile Orthopaedic Implant

MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202521023779 A) filed by Meril Corporation I Private Limited on March 18, 2025, for Profile Constrained Assembly For Mobile Orthopaedic Implant.

Inventors include Patel, Bhavik R; Kv, Latheesh; Patel, Vyom; Shah, Naman; and Patel, Siddharth.

The application for the patent was published on September 25, 2026, under issue no. 39/2026.

Abstract: Disclosed is a profile constrained assembly (100) for mobile orthopaedic implant. Profile constrained assembly comprises modular shell component (102) adapted to engage with first part of mobile orthopaedic implant and comprising first surface (202) , second surface (204), first internal volume (206); modular ...