MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202617093137 A) filed by Dai Nippon Printing Co. , Ltd. on July 31, 2026, for Power Storage Device And Method For Manufacturing Same, And Outer Package Material For Power Storage Device And Method For Manufacturing Same.
Inventors include Shimada, Shinya; Kanazawa, Sayoko; and Okada, Emiko.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: This power storage device includes an electrode body and an outer package that seals the electrode body. The outer package has an outer package film that wraps the electrode body, and a lid body that seals the electrode body together with the outer package film. Th...