MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088704 A) filed by Qualcomm Incorporated on July 21, 2026, for Package Substrate.
Inventors include Kang, Kuiwon; Bchir, Omar James; We, Hong Bok; and Choi, Seongryul.
The application for the patent was published on July 24, 2026, under issue no. 30/2026.
Abstract: Disclosed are techniques for a structure of a package substrate. In an aspect, a package substrate includes a core dielectric that includes a first surface, a second surface, and a first cavity through the core dielectric. The EPS structure includes a first metallization structure on the first surface of the core dielectric and a second metallization structure on the second surface ...