Intellectual Property India Publishes Patent Application for Package-On-Package With Different Types Of Memory

MUMBAI, India, Oct. 19 -- Intellectual Property India has published a patent application (202647120091 A) filed by Qualcomm Incorporated on October 07, 2026, for Package-On-Package With Different Types Of Memory.

Inventors include Gupta, Piyush; Andreev, Boris Dimitrov; Srinivas, Vaishnav; Palacharla, Subbarao; and Bhat, Girish.

The application for the patent was published on October 16, 2026, under issue no. 42/2026.

Abstract: Various embodiments may include a Package on Package (PoP) having a bottom package comprising a system-on-chip (SoC) and a bottom substrate, a top package comprising a top substrate, a first memory die, and a second memory die, wherein the first and second memory dies are different in at least one of: memory type,...