Intellectual Property India Publishes Patent Application for Package Including Substrates, Integrated Devices, And Heat Slug

MUMBAI, India, Oct. 19 -- Intellectual Property India has published a patent application (202647120239 A) filed by Qualcomm Incorporated on October 07, 2026, for Package Including Substrates, Integrated Devices, And Heat Slug.

Inventors include Kumar, Rajneesh; Aldrete, Manuel; Gupta, Piyush; Yan, Bohan; and Patil, Aniket.

The application for the patent was published on October 16, 2026, under issue no. 42/2026.

Abstract: A device includes a first integrated device coupled to a first substrate and a second integrated device coupled to a second substrate. The first substrate is disposed between the first integrated device and the second integrated device. The first integrated device is electrically connected to the second integrated devic...