MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202647077424 A) filed by Qualcomm Incorporated on June 23, 2026, for Package Comprising Integrated Devices And An Interconnection Device.
Inventors include Patil, Aniket; Aldrete, Manuel; Gupta, Piyush; Buot, Joan Rey Villarba; Sun, Yangyang; and We, Hong Bok Number.
The application for the patent was published on July 03, 2026, under issue no. 27/2026.
Abstract: A package comprising a first substrate; a first integrated device coupled to the first substrate through at least a first plurality of solder interconnects, wherein the first integrated device comprises a plurality of through substrate vias; an interconnection device coupled to a back side o...