Intellectual Property India Publishes Patent Application for Package Comprising An Integrated Device And An Offset Memory Device

MUMBAI, India, Oct. 19 -- Intellectual Property India has published a patent application (202647120187 A) filed by Qualcomm Incorporated on October 07, 2026, for Package Comprising An Integrated Device And An Offset Memory Device.

Inventors include Aldrete, Manuel; Kumar, Rajneesh; Patil, Aniket; Lane, Ryan; and Gupta, Piyush.

The application for the patent was published on October 16, 2026, under issue no. 42/2026.

Abstract: A package comprising a metallization portion; an integrated device coupled to the metallization portion; a substrate; a plurality of wire bonds coupled to the substrate and the metallization portion; and an encapsulation layer coupled to the metallization portion, wherein the encapsulation layer at least partially e...