Intellectual Property India Publishes Patent Application for Package Comprising A Passive Device With A Front Side Protection Layer

MUMBAI, India, Oct. 19 -- Intellectual Property India has published a patent application (202647120185 A) filed by Qualcomm Incorporated on October 07, 2026, for Package Comprising A Passive Device With A Front Side Protection Layer.

Inventors include Song, Yanmei; Yun, Sun Woong; Chou, Chung-Yi; Xu, Jianwen; and Stone, William.

The application for the patent was published on October 16, 2026, under issue no. 42/2026.

Abstract: A package comprising a first integrated device; a package interposer coupled to the first integrated device; and a passive device located at least partially in the package interposer. The passive device comprises a passive device substrate; a plurality of trench capacitors located at least partially in the passive...