Intellectual Property India Publishes Patent Application for Orbital Wire-Arc Additive Manufacturing (waam) Unit For Direct Conversion Of Captured Metallic Debris”

MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202631069065 A) filed by C. V. Raman Global University on June 02, 2026, for Orbital Wire-Arc Additive Manufacturing (waam) Unit For Direct Conversion Of Captured Metallic Debris”.

Inventors include Debankur Pal B; Sayan Pal; Siba Kumar Pujari; and Smita Rani Parija.

The application for the patent was published on June 19, 2026, under issue no. 25/2026.

Abstract: The present invention relates to an Orbital Wire-Arc Additive Manufacturing (WAAM) Unit for Direct Conversion of Captured Metallic Debris. The invention provides an integrated spacedeployable manufacturing platform capable of capturing metallic orbital debris, processing the recovered mater...