MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202647101303 A) filed by Oracle International Corporation on August 21, 2026, for Networking Design For Substrate In The Overlay.
Inventors include O'Connor, Ryan James; Bockman, Bryce; Patil, Abhay; Zahedi, Shahab; King, Myron Decker; Kailasa, Soumya; Aysola, Ravi Sastry; and Waghela, Jatin.
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: A cloud service is provided and accessible via a virtual IP address in a virtual cloud network (VCN), where the VCN is part of an overlay network. A source network virtualization device (NVD) receives a first packet destined to the virtual IP address. The sou...