Intellectual Property India Publishes Patent Application for Mold, Resin Molding Device, And Method For Producing Resin Molded Article

MUMBAI, India, June 24 -- Intellectual Property India has published a patent application (202647069599 A) filed by Towa Corporation on June 03, 2026, for Mold, Resin Molding Device, And Method For Producing Resin Molded Article.

Inventor includes Kitahara Koichi.

The application for the patent was published on June 12, 2026, under issue no. 24/2026.

Abstract: A mold (C) is provided with a first mold (LM) in which an object to be molded (Sa) is disposed and a second mold (UM) that is disposed facing the first mold (LM) and holds a release film (F) on a facing surface (33) that faces the first mold (LM). A cavity (MC) and excess resin storage cavities (11a, 12) are formed in at least one of the first mold (LM) and the second mold (UM). The...