MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202617095929 A) filed by Wieland-Werke AG on August 07, 2026, for Modular Functional Unit For Connecting High-Performance Electronic Components.
Inventors include Scheuss, Michael; Lehnert, Christian; and Wlflik, Oliver.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: The invention relates to a modular functional unit (1) for connecting high-performance electronic components (2) in a cooling system (3) with a 2-phase cooling fluid (4), the functional unit (1) being a current-conducting functional element (11), and the functional element (11) having a metallic surface (111) which is in contact with ...